Much simplified compared with conventional micro LED chip process
High-speed chip transfer by unique stage architecture and beam geometry
Accurate micro LED chip transfer by high-precision motion technology
Process
Equipment
Transfer Parts
Process
Equipment
Transfer Parts
Micro LED Chip LLO
Contact-LLO
Gap-LLO
Multi Laser Lift Off Equipment
(U / Excimer Laser)
SQDP
Process
Equipment
Transfer Parts
Transfer to SQRP Series
(Release Plate)
Bonding / Debonding Equipment
SQRP
Process
Equipment
Transfer Parts
Ultra High Speed Mass Transfer
to SQDP-G Series
(Large Size (2nd) Donor Plate)
Laser Mass Transfer Equipment
(U / Excimer Laser)
EZ-PETAMP-Dot
EZ-PETAMP-Flat
EZ-PETAMP-Flat-Large(6 inch)
EZ-PETAMP-Dot-Large(6 inch)
Process
Equipment
Transfer Parts
Transfer to Backplane
SQDP-G
Process
Equipment
Transfer Parts
Micro LED Chip Repair
High-Speed Repair Equipment
(U / Excimer Laser)
(Trimming / Repair Equipment)
EZ-PETAMP-1Dot