Micro LED Wafer (before LLO)
Shin-Etsu Unique Material Technology
Excimer Laser Equipment
Micro LED Wafer (before LLO)
Much simplified compared with conventional micro LED chip process
High-speed chip transfer by unique stage architecture and beam geometry
Accurate micro LED chip transfer by high-precision motion technology
process to peel off and transfer micro LED chips to receptor board by irradiating excimer laser from the back side of the micro LED wafer or transfer parts on which chips are arrayed.
Shin-Etsu Group provides transfer equipment and parts suitable both for Contact-LLO (transfer micro LED chips to transfer parts with contact) and for Gap-LLO (transfer micro LED chips to transfer parts without contact).
We can provide transfer process suitable for various applications (TV, smart watch, etc).
Process
Equipment
Transfer Parts
Process
Equipment
Transfer Parts
Micro LED Chip LLO
Contact-LLO
Gap-LLO
Multi Laser Lift Off Equipment
(U / Excimer Laser)
SQDP
Process
Equipment
Transfer Parts
Transfer to SQRP Series
(Release Plate)
Bonding / Debonding Equipment
SQRP
Process
Equipment
Transfer Parts
Ultra High Speed Mass Transfer
to SQDP-G Series
(Large Size (2nd) Donor Plate)
Laser Mass Transfer Equipment
(U / Excimer Laser)
EZ-PETAMP-Dot
EZ-PETAMP-Flat
EZ-PETAMP-Flat-Large(6 inch)
EZ-PETAMP-Dot-Large(6 inch)
Process
Equipment
Transfer Parts
Transfer to Backplane
SQDP-G
Process
Equipment
Transfer Parts
Micro LED Chip Repair
High-Speed Repair Equipment
(U / Excimer Laser)
(Trimming / Repair Equipment)
EZ-PETAMP-1Dot
