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Features

  • Simple

    Laser Lift Off*

    Much simplified compared with conventional micro LED chip process

  • Ultra High Speed

    Consecutive mass transfer by laser

    High-speed chip transfer by unique stage architecture and beam geometry

  • Accurate

    High-precision laser transfer

    Accurate micro LED chip transfer by high-precision motion technology

*Laser Lift Off (LLO) is:

process to peel off and transfer micro LED chips to receptor board by irradiating excimer laser from the back side of the micro LED wafer or transfer parts on which chips are arrayed.
Shin-Etsu Group provides transfer equipment and parts suitable both for Contact-LLO (transfer micro LED chips to transfer parts with contact) and for Gap-LLO (transfer micro LED chips to transfer parts without contact).
We can provide transfer process suitable for various applications (TV, smart watch, etc).

Contact-LLO

or

Gap-LLO

Micro LED Chip
Transfer Completed

Process Technologies and Products
Provided by Shin-Etsu Chemical Group

Integrated micro LED chip transfer process from micro LED wafer to backplane

Process

Equipment

Transfer Parts

Process

Equipment

Transfer Parts

Micro LED Chip LLO

Multi Laser Lift Off Equipment
(U / Excimer Laser)

SQDP

Process

Equipment

Transfer Parts

Transfer to SQRP Series
(Release Plate)

Bonding / Debonding Equipment

SQRP

Process

Equipment

Transfer Parts

Mass Transfer
to SQDP-G Series
(Large Size Donor Plate)

Laser Mass Transfer Equipment
(U / Excimer Laser)

EZ-PETAMP-Dot

EZ-PETAMP-Flat

EZ-PETAMP-Large

Process

Equipment

Transfer Parts

Micro LED Chip Repair

High-Speed Repair Equipment
(U / Excimer Laser)
(Trimming / Repair Equipment)

EZ-PETAMP-1Dot