In the micro LED chip manufacturing process,

1. Flip chip transfer of micro LED chips is realized donor plate by donor plate (SQDP Series made by Shin-Etsu Chemical Co., Ltd.).
2. Collectively transfer micro LED chips from donor plate (SQDP series made by Shin-Etsu Chemical Co., Ltd.) to release plate (SQRP series made by Shin-Etsu Chemical Co., Ltd.)

Bonding Equipment and Debonding Equipment are one set.
- Bonding Equipment with heat conditioner
- Bonding Equipment with uniform-pressurized transfer using long life diaphragm
- Debonding Equipment flexible to PSA (pressure sensitive adhesive) condition