• Removing defective micro LED chips and filling good chips
• In trimming mode, defective micro LED chips are selectively removed by irradiation with U / Excimer laser, based on inspection equipment data.
• In repair mode, good micro LED chips are transferred from release plate
  (SQRP Series made by Shin-Etsu Chemical Co., Ltd.) to the missing position,
  based on inspection equipment data.
• Efficiently utilize micro LED chips by transferring from release plate by Gap-LLO technology
• Accurate position trimming and repair by a combination of Galvanoscanner and photo mask

Uniquely developed technology "Uniform irradiation optics" and "Stage architecture“ achieve
- Non-contact & damage-less, high-throughput chip transfer
- Chip transfer accuracy of ±3 μm
- Minimized thermal drift