• Collectively transfer micro LED chips from wafer on which micro LED chips are formed to donor plate (SQDP series made by Shin-Etsu Chemical Co., Ltd.)
• Micro LED chips can be transferred in contact condition (Contact-LLO)
  or non-contact condition (Gap-LLO)
• Pitch-conversion of micro LED chips by Gap-LLO technology

Uniquely developed technology "Uniform irradiation optics" and "Stage architecture“ achieve
- Non-contact & damage-less, high-throughput chip transfer
- Chip transfer accuracy of ±3 μm
- Minimized thermal drift