Large size temporary carrier
for LLO*
Laser Mass Transfer Equipment
(U / Excimer Laser)
(made by Shin-Etsu Engineering Co., LTD.)
SQDP-G224-60-
3035
300mm x 350mm
(Thickness 1.1mm)
Substrate for ultra-high-speed transfer
with pitch conversion
Laser Mass Transfer Equipment
(U / Excimer Laser)
(made by Shin-Etsu Engineering Co., LTD.)
SQRP-4021-1-4
Φ4inch
(Thickness 1mm)
*LLO = Laser Lift Off
Shin-Etsu Silicone
Shin-Etsu Synthetic Quartz Glass Substrate
EZ-PETAMP Series
Pick and place of micro LED chip according to customer’s request.
Collaboration of Shin-Etsu unique Silicone technology (optimization of stickiness) and fine-processing precision work technology.
SQDP Series (Shin-Etsu Quartz Donor Plate, or called “Donor plate”)
Shin-Etsu unique Silicone film on precision-worked Shin-Etsu Synthetic Quartz Glass Substrate. Receiving micro LED chips (Receptor), and transferring them to next step after cleaning process (Donor) without changing the substrate.
SQRP Series (Shin-Etsu Quartz Donor Plate, or called “Release plate”)
Ablation layer formed on Shin-Etsu Synthetic Quartz Glass Substrate with high laser transmission. Ablation layer is made of plastic with unique Shin-Etsu technology.
With unique Shin-Etsu technology,
- Micro LED chip transfer with lower power laser
- Less debris
- Ultra high speed transfer with pitch conversion
