• Ultra high speed mass transfer of micro LED chips from release plate (SQRP series made by Shin-Etsu Chemical Co., Ltd.) to large size (2nd) donor plate (SQDP-G series made by Shin-Etsu Chemical Co., Ltd.)
• Pitch conversion from original designed pitch on release plate to display pixel pitch on SQDP-G by Gap-LLO technology
• Efficient micro LED chip transfer by large-size SQDP-G series

Uniquely developed technology "Uniform irradiation optics" and "Stage architecture“ achieve
- Non-contact & damage-less, high-throughput chip transfer
- Chip transfer accuracy of ±3 μm
- Minimized thermal drift